Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece

摘要

A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip includes executing a relative movement between the workpiece and a wire gang of a wire saw with the aid of a forward feed device with a defined forward feed rate so as to slice the wafers. The forward feed rate is varied through the course of the method and includes being set to a value v1 at a cutting depth of 50% of the workpiece diameter. Subsequently, the forward feed rate is to a value v2>1.15×v1 as the forward feed rate passes through a local maximum. The forward feed rate is set to a value v3v3.

主权项

1. A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip, the method comprising:
executing a relative movement between the workpiece and a wire gang of a wire saw in a direction perpendicular to a longitudinal axis of the workpiece with the aid of a forward feed device with a defined forward feed rate, by which the workpiece is guided through the wire gang so as to be sliced into a plurality of wafers; and varying the forward feed rate through the course of the method including: setting the forward feed rate to a value v1 at a cutting depth of 50% of the workpiece diameter; after reaching the cutting depth of 50% , increasing the forward feed rate to a value v2 ≧1.15×v1 as a local maximum; subsequently to increasing the forward feed rate to the local maximum, decreasing the forward feed rate to a value v3 v3.