发明名称 Blind via printed circuit board fabrication supporting press fit connectors
摘要 An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.
申请公布号 US9179546(B2) 申请公布日期 2015.11.03
申请号 US201213628532 申请日期 2012.09.27
申请人 Dell Products L.P. 发明人 Mundt Kevin W.;Adrian Jason D.
分类号 H01K3/10;H05K1/11;H05K3/00;H05K3/42;H05K3/30;H05K3/46;H01R12/58 主分类号 H01K3/10
代理机构 Terrile, Cannatti, Chambers & Holland, LLP 代理人 Terrile, Cannatti, Chambers & Holland, LLP ;Holland Robert W.
主权项 1. A method for fabrication of a circuit board, the method comprising: forming blind vias at an upper surface of a first circuit board portion; drilling openings through the blind vias and lower surface of the first circuit board portion; flowing plating fluids through the blind vias and openings to plate the blind vias; disposing ink over the lower surface of the first circuit board portions to cover the openings; coupling a second circuit board portion at the lower surface of the first circuit board portion; and drilling vias through the first and second circuit board portions to support an interface between the first and second portions.
地址 Roud Rock TX US