发明名称 |
Semiconductor light emitting device |
摘要 |
According to one embodiment, a semiconductor light emitting device includes an electrode layer, a first semiconductor layer, a first elongated electrode, a second semiconductor layer, and a light emitting layer. The first semiconductor layer includes a crystal having a cleavage plane. The first semiconductor layer includes a first thin film portion and a thick film portion. The first thin film portion extends in a first direction perpendicular to a stacking direction from the electrode layer toward the first semiconductor layer. The first thin film portion has a first thickness. The thick film portion is arranged with the first thin film portion in a plane perpendicular to the stacking direction. An angle between the first direction and the cleavage plane is not less than 3 degrees and not more than 27 degrees. The first elongated electrode extends in the first direction in contact with the first thin film portion. |
申请公布号 |
US9178111(B2) |
申请公布日期 |
2015.11.03 |
申请号 |
US201314083927 |
申请日期 |
2013.11.19 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Tajima Jumpei;Zaima Kotaro;Hikosaka Toshiki;Ono Hiroshi;Sugiyama Naoharu;Nunoue Shinya |
分类号 |
H01L33/00;H01L27/14;H01L31/0232;H01L23/48;H01L23/52;H01L29/40;H01L33/18;H01L29/04;H01L33/36;H01L51/44;H01L33/38;H01L33/16;H01L21/02;H01L31/036;H01L33/20;H01L31/0224;H01L33/22;H01L33/32 |
主分类号 |
H01L33/00 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A semiconductor light emitting device, comprising:
an electrode layer; a first semiconductor layer of a first conductivity type including a crystal having a cleavage plane, the first semiconductor layer including a first thin film portion extending in a first direction perpendicular to a third direction from the electrode layer toward the first semiconductor layer, the first thin film portion having a first thickness, and a thick film portion arranged with the first thin film portion in a plane perpendicular to the third direction, the thick film portion having a second thickness thicker than the first thickness, and an angle between the first direction and the cleavage plane being not less than 3 degrees and not more than 27 degrees; a first elongated electrode extending in the first direction in contact with the first thin film portion; a second semiconductor layer of a second conductivity type provided between the electrode layer and the first semiconductor layer and electrically connected to the electrode layer; and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. |
地址 |
Minato-ku JP |