Apparatus and method for increasing bandwidths of stacked dies

摘要

A package structure includes a plurality of die carriers identical to each other. The respective features in each of the plurality of die carriers vertically overlap corresponding features in other ones of the plurality of die carriers. Each of the plurality of die carriers includes a plurality of through-substrate vias (TSVs) including a plurality of data buses. The plurality of die carriers is stacked and electrically connected to each other through the plurality of TSVs. The package structure further includes a plurality of device dies. Each of the plurality of device dies is bonded to one of the plurality of die carriers. Each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies.

主权项

1. A package structure comprising:
a plurality of data buses; a first die carrier comprising:
a portion of each of the plurality of data buses, wherein each of the plurality of data buses penetrates through the first die carrier; a first device die and a second device die bonded to opposite sides of the first die carrier, wherein the plurality of data buses comprises a first data bus and a second data bus configured to dedicate to data transmission of the first device die and the second device die, respectively; a second die carrier over and stacked on the first die carrier, wherein the second die carrier comprises an additional portion of each of the plurality of data buses, and wherein each of the plurality of data buses penetrates through the second die carrier; and a third device die and a fourth device die bonded to opposite sides of the second die carrier, wherein the plurality of data buses comprises a third data bus and a fourth data bus configured to dedicate to data transmission of the third device die and the fourth device die, respectively.