Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

摘要

The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

主权项

1. A curable resin composition comprising, as essential components,
(A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule which is free of any siloxane (Si—O—Si) units, or, reaction products of one or more kinds of compounds selected from the organic compounds having at least two carbon-carbon double bonds reactive with SiH groups per molecule which are free of any siloxane (Si—O—Si) units, with a compound containing a SiH group, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, (E) an inorganic filler, and (F) a white pigment, wherein the component (E) and the component (F) are contained in a total amount of 70% to 95% by weight, and wherein the ratio of the number (Y) of SiH groups in a total amount of the component (B) within the composition to the number (X) of carbon-carbon double bonds in a total amount of the component (A) within the composition is 3≧Y/X≧0.3.