Leadless surface mount assembly package and method of manufacturing the same

摘要

Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained.

主权项

1. A leadless surface mount assembly package, comprising:
a first lead; a second lead; a third lead; a chip fixed on an upper surface of the first lead and electrically coupled to the third lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip; and a molding compound for molding the first lead, the second lead, the chip, and the clip, the side wall ends of the first lead and the second lead being substantially flush with the side wall surfaces of the package, an end of the third lead is only exposed from the molding compound without outward extending from the molding compound and a side of the molding compound from which the third lead is exposed is different from a side of the molding compound from which the first lead and the second lead are exposed.