METHOD OF MANUFACTURING STRUCTURE, AND STRUCTURE MANUFACURED USING THE SAME

摘要

According to the present invention, provided is a method for manufacturing a structure, comprising: a step of preparing a microstructured substrate including a first sensor area and a second sensor area, and having a microstructure on a surface; a step of preparing a cap substrate including a bump formed above the surface facing the microstructured substrate, combined with a part of the microstructured substrate, and for sealing and mounting the microstructured substrate, and a first bonding reaction support layer formed with thickness lower than the bump, and for maintaining the interval between the microstructured substrate and the cap substrate at a regular interval after being combined with the microstructured substrate by controlling eutectic reaction of the bump; a step of sealing and mounting the first sensor area of the microstructured substrate by combining the microstructured substrate and the cap substrate by using eutectic reaction of the bump while the first sensor area and the second sensor area are in a state with first pressure; and a step of combining the first bonding reaction support layer with the microstructured substrate while the second sensor area is in a state with second pressure.