发明名称 BASE PLATE FOR POWER MODULE AND BASE PLATE FOR POWER MODULE WITH HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a base plate for power module capable of enhancing the joint reliability by bonding a metal layer and a heat sink to prevent generating of separation in the boundary between a ceramic substrate and the metal layer, and to provide a base plate for power module with heat sink.SOLUTION: A base plate for power module 10 has a flange part 15 protruding from a side face 13a of a metal layer 13, which is formed around entire circumference of the side face 13a of the metal layer 13. The flange part 15 is formed so that the length 15 L protruding from the base end part connected to the side face 13a of the metal layer 13 to the front end thereof is larger than a distance 13M between the side face 13a of the metal layer 13 and the base end part of the connection position to the plane opposite to the plane of the metal layer 13 bonded to a ceramic substrate 11.
申请公布号 JP2015192122(A) 申请公布日期 2015.11.02
申请号 JP20140070471 申请日期 2014.03.28
申请人 MITSUBISHI MATERIALS CORP 发明人 KATO HIROKAZU
分类号 H01L23/13;H01L23/36 主分类号 H01L23/13
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