| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free ball-like Au-Sn-Ag based solder alloy for high temperature being especially excellent in wet spreadability and bondability, being excellent in workability, stress relaxation property and the like, having a preferable melting point between the melting points of an Au-Sn solder alloy and an Au-Ge solder alloy, having a small content of Au and being low cost.SOLUTION: In a ball-like Au-Sn-Ag based solder alloy, an aspect ratio of a shape is 1.00 or more and 1.20 or less, the content of Sn is more than 38.0 mass% and less than 43.0 mass%, the content of Ag is 12.5 mass% or more and 15.0 mass% or less and the balance is Au except inevitably contained elements in the production. |
