| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire tool capable of suppressing variation of thickness of a wafer to be cut and occurrence of warping, and a production method thereof.SOLUTION: A wire holding an abrasive grain 13 is subjected to dressing in advance. By the dressing, part of an abrasive grain plating layer 17 of a surface of the abrasive grain 13 and part of a diamond abrasive grain 19 are removed. As the method of dressing, for example, a dummy material made of alumina is cut for a predetermined time or more. The dressing is performed until the variation of the outer diameter of the wire tool becomes a range of ±5 μm, with respect to the average diameter. |
