| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder composition capable of suppressing Bi deposition onto a junction interface between solder, and a substrate or a component; and to provide a solder paste, a solder junction structure and an electronic apparatus.SOLUTION: A solder composition includes Cu particles and solder particles. The solder particles contain Bi, and the content ratio of Bi is 0.1 mass% to 4.0 mass% to the total amount of the Cu particles and the solder particles. |
