| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition high in dielectric constant, having foaming resistance, excellent in step followability as well as processability of members where the adhesive is in an uncrosslinked status before UV irradiation.SOLUTION: There is provided an adhesive composition containing (a) an acryl polymer having a percentage of a hydroxyl group-containing (meth)acrylic monomer of 30 to 50 wt.% and the percentage of an amide group-containing monomer of 0.1 to 10 wt.% in a monomer composition and a glass transition temperature of 0°C or less, (b) a multifunctional (meth)acrylate compound and (c) a photoinitiator. |
