发明名称 CHEMICAL MECHANICAL POLISHING PAD WITH WINDOW WHICH IS SOFT AND IS CAPABLE OF CONDITIONING
摘要 PROBLEM TO BE SOLVED: To provide a polymer terminal point detection window composition having durability desired for a severe polishing usage.SOLUTION: A chemical mechanical polishing pad 10 includes a polishing layer 20 and a window 30 assembled into the polishing layer. Therein, the polishing layer includes a reaction product of a component comprising a polishing layer prepolymer and a polishing layer curing agent system, the polishing layer curing agent system includes a polishing layer amine-initiated polyol curing agent, a polishing layer high-molecular weight polyol curing agent and a polishing layer bifunctional curing agent, the window comprises a reaction product of a component including a window prepolymer and a window curing agent system, the window curing agent system includes a window bifunctional curing agent, a window amine-initiated polyol curing agent and a window high-molecular weight polyol curing agent, and the polishing layer has a density of ≥0.6 g/cm, a Shore D hardness of 5 to 40, a breakage point elongation of 100 to 450% and a cutting speed of 25 to 150 μm/hr.
申请公布号 JP2015189003(A) 申请公布日期 2015.11.02
申请号 JP20150066482 申请日期 2015.03.27
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC;DOW GLOBAL TECHNOLOGIES LLC 发明人 QIAN BAINIAN;MARTY W DEGROOT;MICHELLE K JENSEN;JAMES MURNANE;HENDRON JEFFREY J;JOHN G NOWLAND;DAVID B JAMES;YEH FENGJI
分类号 B24B37/24;B24B37/013;B24B37/22;C08G18/48;C08J9/32;H01L21/304 主分类号 B24B37/24
代理机构 代理人
主权项
地址