发明名称 MULTILAYER WIRING SUBSTRATE AND CAPACITANCE ADJUSTMENT METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate capable of adjusting capacitance even after manufacturing.SOLUTION: In a multilayer wiring substrate 1 whose capacitor is constituted of two planes provided across an insulating layer, a conductor part that connects either one via of a via 21 connected to one plane and a via 22 connected to the other one plane and a plane is removed by a back drill method.
申请公布号 JP2015192002(A) 申请公布日期 2015.11.02
申请号 JP20140067715 申请日期 2014.03.28
申请人 RICOH CO LTD 发明人 MURATA KAZUKI
分类号 H05K3/46;H05K1/16 主分类号 H05K3/46
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