| 摘要 |
A semiconductor device has a semiconductor chip comprising: a first silicon substrate having a first surface and a second surface facing the opposite side; the semiconductor device formed on the first surface or the inside of the first surface; a plurality of first contact pads formed on the first surface electrically connected with the semiconductor device; a layer of a heat-conductive material on the second surface; and a plurality of first vias partially formed through the layer of the heat-conductive material. |
