| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a semiconductor manufacturing method, which can divide a wafer into small piece wafers by tearing the wafer along wafer cut division lines formed on a surface of the wafer.SOLUTION: A semiconductor manufacturing device comprises a separate table 151 where a wafer W is placed and fixed for dividing the wafer into small-piece wafers by tearing the wafer along wafer cut division lines formed on a surface of the wafer, and which is composed of separate table parts 151a-151d which are obtained by dividing the separate table 151 into at least three pieces corresponding to wafer cut division lines L2X, L2Y, in which neighboring pieces are capable of moving in a Z-axis direction. The wafer is torn by fixing the wafer W on the separate table 151 so as to correspond the wafer cut division lines L2X, L2Y to boundaries among the separate table parts 151a-151d, respectively and moving the separate table parts (151a-151d) in the Z-axis direction. |
