CIRCUIT CONFIGURATION AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit configuration and a method of manufacturing the same capable of simplifying a manufacturing step and of suppressing solder flow in reflow processing of a solder material.SOLUTION: A circuit configuration 1 comprises: a plurality of bus bars 2 having Sn-based plating on a surface; a circuit board 3 having substrate side openings 30; an adhesive sheet 4 that has sheet side openings 40 at a position corresponding to the substrate side openings 30, and that interposes between the bus bars 2 and the circuit board 3 to stick both to each other; and an electronic component 5 soldered onto a surface of the bus bars 2 through the substrate side openings 30 and the sheet side openings 40. Both surfaces of the adhesive sheet 4 have adhesiveness by the adhesive component. The adhesive component is an acrylic adhesive component or a silicone adhesive component. In a case where the adhesive component is the acrylic adhesive component, a thickness of the adhesive sheet is 100 μm or less. In a case where the adhesive component is the silicone adhesive component, a thickness of the adhesive sheet is 150 μm or less.