| 发明名称 |
RESIN COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation having many silica fillers, low linear expansion coefficient, a certain degree of flowability and good handling during potting.SOLUTION: There is provided a liquid resin composition containing 75 wt.% or more a silica filler and a matrix resin. |
| 申请公布号 |
JP2015189920(A) |
申请公布日期 |
2015.11.02 |
| 申请号 |
JP20140069957 |
申请日期 |
2014.03.28 |
| 申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
TANAKA TOSHIYUKI;SAITO MASANORI;DAO PHUONG THI KIM;ISOJIMA TAKESHI |
| 分类号 |
C08L101/00;C08K3/36;C08L83/06 |
主分类号 |
C08L101/00 |
| 代理机构 |
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