| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding composite sheet excellent in stickability to a semiconductor wafer, and having high reliability when going through the history of temperature change, in which migration of epoxy resin from a film-like adhesive to an adjoining adhesive layer is suppressed.SOLUTION: In a die bonding composite sheet 1 including a base material film 11, an adhesive layer 12 and a film-like adhesive 13 in this order, the film-like adhesive 13 contains epoxy resin, phenolic resin having a softening point of 115°C or more, and an acrylic copolymer having a glass-transition temperature of less than 0°C. |
