| 摘要 |
PROBLEM TO BE SOLVED: To provide a power supply device capable of preventing solder from being flown into a surface of a substrate where components are mounted when the components are soldered onto the substrate, and of further ensuring that a resin member filled in a case is provided so as to cover one surface and the other surface of the substrate.SOLUTION: A power supply device according to an embodiment comprises: a substrate that has a convex part and a recessed part at an end part, and on which components are mounted by solder; and a case for housing the substrate. The convex part of the substrate abuts on an inner part of the case, and thereby, a resin member filled in the case through a hole part configured by the convex part of the substrate, the recessed part of the substrate, and the case, is provided so as to cover one surface and the other surface of the substrate. |
