| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of determining a bonding temperature condition of an electronic component capable of easily determining a bonding temperature condition at thermocompression bonding of the electronic component.SOLUTION: A method of determining a bonding temperature condition of an electronic component at the time when the electronic component is thermocompression-bonded to an adherend while interposing an adhesive film, includes: a bonding temperature determination material selection step S11 of selecting a plurality of bonding temperature determination materials that have different melting temperatures; a pattern formation step S12 of forming a pattern by the selected bonding temperature determination materials, that can be confirmed visually, on any one of respective opposed surfaces of the electronic component and the adherend; a thermocompression bonding step S13 of thermocompression-bonding the electronic component to the adherend after the formation of the pattern; a molten state determination step S14 of determining a molten state of the pattern by the bonding temperature determination materials after the thermocompression bonding; and a bonding temperature determination step S15 of determining a bonding temperature at the thermocompression bonding on the basis of the determination result. |
