| 摘要 |
An apparatus for inspecting a substrate unit which inspects a cutting defect of a unit substrate separated from a substrate by cutting a bridge is disclosed. The apparatus for inspecting a unit substrate comprises: a first measuring unit which is adjacent to a cut face and a first measurement contact point of the cut face on the left face of the unit substrate, and in which the first tip comes in contact with the first reference contact point of a non-cut face, to measure the position; a second measuring unit which is adjacent to the cut face and a second measurement contact point of the cut face on the right face of the unit substrate, and in which a second tip comes in contact with a second reference contact point of a non-cut face, to measure the position; and a defect determining unit which compares the difference between the width between non-cut faces and the width between cut faces with a first threshold value or compares the difference between the cut face and the non-cut face adjacent to the cut face with a second threshold value by using the measured first and second reference contact points and the measured first and second measurement contact points, to determine a cutting defect of the separated unit substrate. |
