ONE-COMPONENT THERMOSETTING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a one-component resin composition which can achieve both excellent storage stability and curing speed.SOLUTION: This invention provides a one-component thermosetting resin composition comprising an epoxy compound, a gallium compound and a silanol source compound, the thermosetting resin composition having a curing time at 25°C of 48 hours or longer and a curing time at 150°C of within 6 hours.