用于一脆性基板之切割方法及切割设备;CUTTING METHOD AND CUTTING APPARATUS FOR A BRITTLE SUBSTRATE

摘要

本发明系关于一种用于一脆性基板之切割方法及切割设备。脆性基板包含一第一表面及与第一表面相对之一第二表面。切割设备利用切割方法以切割脆性基板。本发明切割方法包含以下步骤：覆盖一硬度小于脆性基板之可挠性薄膜于脆性基板之第一表面上；及沿于第一表面上之一预定切割线刻划可挠性薄膜及脆性基板之第一表面，刻划步骤切穿可挠性薄膜，于脆性基板之第一表面上形成一刻划开口。; and scribing the flexible film and the first surface of the brittle substrate along a predetermined cutting line on the first surface to form a scribed opening on the first surface of the brittle substrate; the scribing step cuts through the flexible film toward the first surface of the brittle substrate.