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发明名称
配线电路基板及其制造方法
摘要
申请公布号
TWI507094
申请公布日期
2015.11.01
申请号
TW100124207
申请日期
2011.07.08
申请人
日东电工股份有限公司
发明人
井上真一;花园博行;长谷川峰快
分类号
H05K1/03;H05K3/10
主分类号
H05K1/03
代理机构
代理人
林志刚 台北市中山区南京东路2段125号7楼
主权项
一种配线电路基板,系具有:由多孔质体膜构成之绝缘层;及形成于上述绝缘层上之导体图案,上述多孔质体膜,系对400nm以上800nm以下之波长区域之至少一部分波长之光,具有50%以上之反射率。
地址
日本
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