发明名称 用于快速冷却基板的方法与设备;METHODS AND APPARATUS FOR RAPIDLY COOLING A SUBSTRATE
摘要 于此提供一种用以快速冷却基板的方法与设备。在一些实施例中,冷却腔室包含:腔室本体,具有内容积;基板支撑件,设置于容积中并具有基板支撑表面;板,相对基板支撑件而设置于腔室本体中且可相对基板支撑件在第一位置和第二位置间移动,其中第一位置将基板支撑件及板设置成彼此远离,以曝露支撑表面给第一容积,且第二位置将基板支撑件及板设置成彼此邻近,以曝露支撑表面给第二容积,第二容积小于第一容积;复数个流动通道,设置于一或多个板或基板支撑件中,以流动冷却剂;及气体入口,用以提供气体进入第二容积。; a substrate support disposed in the volume and having a substrate support surface; a plate disposed in the chamber body opposite the substrate support and movable with respect to the substrate support between a first position and a second position, wherein the first position disposes the substrate support and plate away from each other to expose the support surface to a first volume, and the second position disposes the substrate support and plate adjacent to each other to expose the support surface to a second volume smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume.
申请公布号 TW201540860 申请公布日期 2015.11.01
申请号 TW104108833 申请日期 2015.03.19
申请人 应用材料股份有限公司 APPLIED MATERIALS, INC. 发明人 拉菲杰立巴利 RAVI, JALLEPALLY;珊索尼史蒂芬V SANSONI, STEVEN V.;沙芬戴亚基伦古莫 SAVANDAIAH, KIRANKUMAR
分类号 C23C14/54(2006.01) 主分类号 C23C14/54(2006.01)
代理机构 代理人 蔡坤财李世章
主权项
地址 美国 US