ELECTROPLATING BATH ANALYSIS

摘要

The present invention relates to an electroplating bath analysis for measuring an amount of an organic additive in a metal electroplating bath using electrochemical impedance spectroscopy. The present invention provides a method for measuring concentration of one or more organic components inside the metal electroplating bath, comprising the steps of: providing a device which has a rotatable working electrode and the counter electrode and the reference electrode and a potentiostat and a frequency response analyzer; obtaining a metal electroplating solution; washing the surface of the working electrode; balancing a convection current in the electroplating solution; overlaying alternating current potential perturbation; measuring an impedance response of the organic additive solution; selecting a frequency in the impedance response; and measuring the concentration of the organic additive by comparing the impedance response of the selected frequency with a calibration curve.