发明名称 CURABLE RESIN COMPOSITION, AND CURED PRODUCT AND LAMINATE OBTAINED BY USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a curable resin composition giving a cured product that has high hardness, excellent adhesiveness to a substrate such as a glass substrate, a plastic substrate and a metal substrate even when the cured product is a thick film having thickness of 10μm or more, and excels in contamination preventing property such as water repellency, oil repellency and fingerprint resistance, slipping property on a surface of the cured product, impact resistance, rubbing resistance, scratch resistance, and the like, and a laminate comprising the curable resin composition.SOLUTION: The curable resin composition comprises the following component (A) and component (B): (A) a compound having an alkoxysilyl group; and (B) an urethane (meth)acrylate having two or more (meth)acryloyl groups in one molecule and/or a polyfunctional (meth)acrylate having an isocyanurate group. The content of component (A) is more than 10 wt.% with respect to the whole solid content of the curable resin composition and is 10 to 80 wt.% with respect to the total amount of component (A) and component (B).</p>
申请公布号 JP2015187205(A) 申请公布日期 2015.10.29
申请号 JP20140064527 申请日期 2014.03.26
申请人 MITSUBISHI CHEMICALS CORP 发明人 TERAUCHI MAKOTO;ONOE MASATO
分类号 C08F290/06;B32B27/16;B32B27/30;C09D4/02;C09D5/00;C09D5/16;C09D7/12;C09D133/00;C09D175/14 主分类号 C08F290/06
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