LED DEVICE AND MANUFACTURING METHOD THEREOF

摘要

Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.

主权项

1. An LED device comprising:
a reflective frame formed around an outer periphery of said LED device; an LED die having a transparent insulating substrate, a semiconductor layer formed on a lower surface of said transparent insulating substrate, and an external connecting electrode formed on said semiconductor layer; and a phosphor member, disposed at least on an upper side of said LED die, for wavelength-converting light emitted from said LED die, wherein an inner wall of said reflective frame is provided with a sloping face which in contact with a side face of said phosphor member, and said sloping face is formed so that an inside diameter of said reflective frame becomes larger from a lower side of said LED die toward the upper side thereof.