发明名称 |
SYSTEMS, METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE CLEANING |
摘要 |
Embodiments of the invention include systems, methods and apparatus for pre-cleaning a substrate after chemical mechanical planarization processing. Embodiments provide a housing; a chuck assembly configured to securely hold a substrate within the housing; and a buffing pad assembly configured to rotate against the substrate while supported within the housing. The buffing pad assembly includes a buff pad, a compressible sub-pad coupled to the buff pad, and a pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly. Numerous additional aspects are disclosed. |
申请公布号 |
US2015306637(A1) |
申请公布日期 |
2015.10.29 |
申请号 |
US201414260210 |
申请日期 |
2014.04.23 |
申请人 |
Applied Materials, Inc. |
发明人 |
Zuniga Steven M.;Brown Brian J. |
分类号 |
B08B1/04;B08B1/00 |
主分类号 |
B08B1/04 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate pre-clean system comprising:
a housing; a chuck assembly configured to securely hold a substrate within the housing; and a buffing pad assembly configured to rotate against the substrate and supported within the housing, wherein the buffing pad assembly includes:
a buff pad,a compressible sub-pad coupled to the buff pad, anda pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly. |
地址 |
Santa Clara CA US |