发明名称 Device and method for audio signal uplink via audio interface
摘要 A device and method for audio signal uplink via an audio interface. In the device, a first pin of the audio interface is connected to an audio uplink signal generating device via a first circuit, and a second pin of the audio interface is connected to the audio uplink signal generating device via a second circuit, where the first circuit and the second circuit are attenuator circuits of each other. This ensures that the first pin and the second pin of the audio interface are both allowed to receive an audio uplink signal transmitted by the audio uplink signal generating device, thus implementing the effect of allowing the audio uplink signal to be transmitted in case the line sequence of the first pin and second pin of the audio interface is unknown.
申请公布号 AU2013275930(B2) 申请公布日期 2015.10.29
申请号 AU20130275930 申请日期 2013.06.14
申请人 TENDYRON CORPORATION 发明人 LI, DONGSHENG
分类号 H04R3/00;H04B1/16;H04B1/40 主分类号 H04R3/00
代理机构 代理人
主权项
地址