| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost and highly reliable semiconductor device, and a manufacturing method thereof.SOLUTION: A first resin layer is provided on a first surface of an upper layer chip. A first wiring layer is provided in the first resin layer and electrically connected with the upper chip. A second resin layer is provided on a front surface side of the first resin layer and expanded to a chip outer region that is outside a side surface of the upper layer chip. A second wiring layer is provided in the second resin layer, is connected with the first wiring layer, and extends to the chip outer region. A lower layer chip is mounted on the front surface side of the first resin layer and connected with the first wiring layer. |
