发明名称 PROBE CARD
摘要 In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.
申请公布号 US2015309074(A1) 申请公布日期 2015.10.29
申请号 US201414265153 申请日期 2014.04.29
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. 发明人 KUO YUNG-HSIN;LIN YUAN-LI;HUANG PO-YI
分类号 G01R1/04;G01R1/073;G01R1/20;G01R1/067 主分类号 G01R1/04
代理机构 代理人
主权项 1. A probe card, comprising: a printed circuit board (PCB) comprising a pair of conductive paths through a first surface and a second surface of the PCB; a substrate comprising a pair of conductive paths through a first surface and a second surface of the substrate, wherein the conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the CB; a pair of probes, wherein the probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate; a capacitive device coupled between a first conductive path through one of the conductive paths of the PCB, one of the conductive paths of the substrate and one of the probes, and a second conductive path through the other of the conductive paths of the PCB, the other of the conductive paths of the substrate and the other of the probes; and a first part configured beyond the second surface of the PCB and holding the capacitive device.
地址 Hsinchu TW