METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES
摘要
Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.
申请公布号
WO2015020725(A3)
申请公布日期
2015.10.29
申请号
WO2014US43081
申请日期
2014.06.19
申请人
TEL NEXX, INC.;TEL EPION INC.
发明人
SERYOGIN, GEORGIY;TETREAULT, THOMAS G.;GOLOVATO, STEPHEN N.;CHANDRASEKARAN, RAMYA