ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE

摘要

The purpose of the present invention is to provide an adhesive film for a semiconductor chip with through electrodes, which is used in order to layer a plurality of semiconductor chips with through electrodes on a semiconductor wafer and which can favorably connect the through electrodes while suppressing voids and which can suppress the length of burrs projecting from the area around the semiconductor chips. The present invention is an adhesive film for a semiconductor chip with through electrodes, which is used in order to layer a plurality of semiconductor chips with through electrodes on a semiconductor wafer, wherein the minimum melt viscosity is 50-2500 Pa∙S and the thixotropic index at 140°C is 8 or less.