STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a method for manufacturing a stacked package. The method includes :a process of locating a via pin for forming a via hole on the via hole pad of an PCB having a line pattern and the via hole pad, covering an upper mold chase, and fixing the via hole pin to the via hole pad and the upper mold chase by closely attaching; a process of injecting a sealing material into the cavity of the upper mold chase and molding it; and a process of removing the upper mold chase and the via hole pin and forming a via hole on the via hole pad.