| 摘要 |
PROBLEM TO BE SOLVED: To provide a dress plate capable of improving degree of parallelism between a polishing operating surface of an upper polishing cloth and a polishing operating surface of a lower polishing cloth, and capable of achieving degree of flatness of a wafer after double-sided polishing.SOLUTION: When dressing, by using a dressing tool in a rectangular shape of a dress plate, a central section, out of the operating surface of the polishing cloth, that is raised from an outer periphery thereof is mainly dressed. This improves degree of parallelism between the operating surface of an upper polishing cloth and the operating surface of a lower polishing cloth as compared with a case that a conventional method of equivalent dressing has been applied so that degree of flatness of a wafer after double-sided polishing can be enhanced. |
