Method of Packaging Semiconductor Devices and Apparatus for Performing the Same

摘要

Provided are a method and an apparatus for packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and defining packaging areas in a longitudinally extending direction along the flexible substrate. The flexible substrate is transferred through a packaging module. An empty area on which a semiconductor device is not mounted is detected from among the packaging areas, and a heat dissipation layer is formed on at least one semiconductor device located in a processing region of the packaging module so as to package the semiconductor device. The heat dissipation layer is formed by coating the semiconductor device with a heat dissipation paint composition, and operations of the packaging module are controlled by a controller to omit a packaging process on the empty area.

主权项

1. A method of packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and defined with packaging areas along an extending direction thereof, the method comprising:
transferring the flexible substrate through a packaging module; detecting, among the packaging areas, an empty area on which a semiconductor device is not mounted; and forming a heat dissipation layer on at least one semiconductor device located in a processing region of the packaging module so as to package the semiconductor device, wherein the heat dissipation layer is formed by coating the semiconductor device with a heat dissipation paint composition and wherein a packaging process is omitted on the empty area.