发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING A LOW PROFILE EMBEDDED WAFER LEVEL BALL GRID ARRAY MOLDED LASER PACKAGE (EWLB-MLP) |
摘要 |
A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An interconnect structure is formed over a first surface of the encapsulant. An opening is formed from a second surface of the encapsulant to the first surface of the encapsulant to expose a surface of the interconnect structure. A bump is formed recessed within the opening and disposed over the surface of the interconnect structure. A semiconductor package is provided. The semiconductor package is disposed over the second surface of the encapsulant and electrically connected to the bump. A plurality of interconnect structures is formed over the semiconductor package to electrically connect the semiconductor package to the bump. The semiconductor package includes a memory device. The semiconductor device includes a height less than 1 millimeter. The opening includes a tapered sidewall formed by laser direct ablation. |
申请公布号 |
SG10201506633S(A) |
申请公布日期 |
2015.10.29 |
申请号 |
SG10201506633S |
申请日期 |
2013.02.25 |
申请人 |
STATS CHIPPAC LTD |
发明人 |
YOON, SEUNG WOOK;CAPARAS, JOSE A.;LIN, YAOJIAN;MARIMUTHU, PANDI C. |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|