| 摘要 |
PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit capable of reducing the arrangement density of a first connection part and a second connection part, and increasing the freedom of design and a manufacturing method thereof.SOLUTION: A first base insulation layer 28 is formed on a metal support substrate 5, and a first conductor pattern 17 including an element side connection part 31 formed on the first base insulation layer and an element side terminal 23 communicating to the element side connection part is formed, and a second base insulation layer 29 is formed on the element side connection part, and a second conductor pattern 18 including a head side connection part 32 formed on the second base insulation layer and a head side terminal 26 communicating to the head side connection part is formed. A suspension substrate 1 with a circuit is formed with an opening 14 penetrating in a thickness direction, and a slider 4 in which a light emitting element 2 and a magnetic head 3 are disposed is configured such that the light emitting element is inserted into the opening 14 so as to be electrically connected to the element side terminal 23, and that the magnetic head 3 is electrically connected to the head side terminal 26. |
