LEAD FRAME WITH RESIN, MANUFACTURING METHOD FOR THE LEAD FRAME, LED PACKAGE AND MANUFACTURING METHOD FOR THE LED PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame with resin that can prevent infiltration of fluid such as sealing resin, soldering flux, moisture or the like from the interface between reflection resin and the lead frame.SOLUTION: A lead frame 30 with resin has a unit lead frame 10a having a die pad 25 and a lead portion 26, and reflection resin 23 provided to the unit lead frame 10a. A plating portion 12 covers an area of the unit lead frame 10a in which the reflection resin 23 is not provided. A gap portion 42 in which the reflection resin 23 and the unit lead frame 10a are separated from each other is provided at the interface 41 between the reflection resin 23 and the unit lead frame 10a, and the plating portion 12 is filled in the gap portion 42.