CONDUCTIVE COMPOSITION, AND METHOD FOR MANUFACTURING CONDUCTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive composition making it possible to form a conductor having high conductivity and high adhesion with a base material as an application object.SOLUTION: A conductive composition contains copper particles, a copper formate-amine complex, and a thermosetting resin. The conductive composition is to be gelatinized after thermal decomposition of the copper formate-amine complex. The copper particles are preferably not less than 0.05μm nor more than 20μm in volume accumulation particle size Dat a cumulative volume of 50 vol.% according to laser diffraction scattering type particle size distribution measurement method. The conductor is manufacturable by forming a coated body by applying the conductive composition to a surface of the base material, and heating the coated body.