CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME

摘要

The present invention relates to a curable resin composition which is characterized by containing: at least one polysiloxane (A) that is selected from the group consisting of polyorganosiloxanes (A1) having two or more alkenyl groups in each molecule and polyorganosiloxy silalkylenes (A2) having two or more alkenyl groups in each molecule; at least one polysiloxane (B) that is selected from the group consisting of polyorganosiloxanes (B1) having two or more hydrosilyl groups in each molecule and polyorganosiloxy silalkylenes (B2) having two or more hydrosilyl groups in each molecule; and a compound (C) that is represented by formula (1). The present invention provides a curable resin composition which is capable of forming a cured product (a sealing material) having excellent thermal shock resistance, excellent reflow resistance and excellent barrier properties against corrosive gases (for example, SOx gases).