| 发明名称 |
METAL-BASED SUBSTRATE, METAL-BASED CIRCUIT BOARD, AND ELECTRONIC DEVICE |
| 摘要 |
This metal-based substrate (100) comprises a metal substrate (101), an insulating resin layer (102) provided on top of said metal substrate (101), and a metal layer (103) provided on top of said insulating resin layer (102). The metal layer (103) comprises copper, and the metal substrate (101) comprises an aluminum alloy that contains silicon carbide. |
| 申请公布号 |
WO2015163056(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
WO2015JP58432 |
申请日期 |
2015.03.20 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
KOMIYATANI TOSHIO;KITAHARA DAISUKE;YUZURIHA YUKIHARU;NII YOSHIHIDE |
| 分类号 |
H05K1/05;H01L23/12;H01L23/36 |
主分类号 |
H05K1/05 |
| 代理机构 |
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代理人 |
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