| 发明名称 |
MULTI-LAYER MICRO-WIRE STRUCTURE |
| 摘要 |
A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking |
| 申请公布号 |
US2015313008(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201414261465 |
申请日期 |
2014.04.25 |
| 申请人 |
Spath Todd Mathew;Cok Ronald Steven |
发明人 |
Spath Todd Mathew;Cok Ronald Steven |
| 分类号 |
H05K1/02;G06F3/044;H05K1/09;G06F3/041 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multi-layer micro-wire structure resistant to cracking, comprising:
a substrate having a surface; one or more micro-channels formed in the substrate; an electrically conductive first material composition forming a first layer located in each micro-channel; and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking. |
| 地址 |
Hilton NY US |
