发明名称 MAGNETIC TUNNEL JUNCTION AND METHOD FOR FABRICATING A MAGNETIC TUNNEL JUNCTION
摘要 An improved magnetic tunnel junction device and methods for fabricating the improved magnetic tunnel junction device are provided. The provided two-etch process reduces etching damage and ablated material redeposition. In an example, provided is a method for fabricating a magnetic tunnel junction (MTJ). The method includes forming a buffer layer on a substrate, forming a bottom electrode on the substrate, forming a pin layer on the bottom electrode, forming a barrier layer on the pin layer, and forming a free layer on the barrier layer. A first etching includes etching the free layer, without etching the barrier layer, the pin layer, and the bottom electrode. The method also includes forming a top electrode on the free layer, as well as forming a hardmask layer on the top electrode. A second etching includes etching the hardmask layer; the top electrode layer, the barrier layer, the pin layer, and the bottom electrode.
申请公布号 US2015311429(A1) 申请公布日期 2015.10.29
申请号 US201514795799 申请日期 2015.07.09
申请人 QUALCOMM Incorporated 发明人 LI Xia;LEE Kangho;CHEN Wei-Chuan;LU Yu;PARK Chando;KANG Seung Hyuk
分类号 H01L43/02;H01L43/12;H01L43/08;G11C11/16 主分类号 H01L43/02
代理机构 代理人
主权项 1. A method for fabricating a device, comprising: fabricating a magnetic tunnel junction, including: forming a bottom electrode on a substrate;forming a pin layer on the bottom electrode;forming a barrier layer on the pin layer;forming a free layer on the barrier layer;etching the free layer and the barrier layer, without etching the pin layer and the bottom electrode;forming a top electrode on the free layer;forming a hardmask layer on the top electrode; andetching the hardmask layer, the top electrode, the pin layer, and the bottom electrode.
地址 San Diego CA US