发明名称 ALLOYS
摘要 Novel alloys which can be employed in joining technology and have improved wetting properties are described.
申请公布号 US2015306709(A1) 申请公布日期 2015.10.29
申请号 US201414345646 申请日期 2014.01.17
申请人 WIEHL Gunther;SILZE Frank;KEMPF Bernd 发明人 WIEHL Gunther;SILZE Frank;KEMPF Bernd
分类号 B23K35/30;B21B1/22;C22C5/08;C22C30/02;B23K1/00;C22C9/00 主分类号 B23K35/30
代理机构 代理人
主权项 1. A solder alloy consisting of from 41% by weight to 75% by weight of copper, from 20% by weight to 44% by weight of silver, from 5% by weight to 15% by weight of gallium and from 0 to 15% by weight of further alloy constituents selected from the group consisting of indium, tin, germanium, titanium, manganese, silicon, nickel and combinations thereof, wherein the constituents add up to 100% by weight and can contain unavoidable impurities and the content of zinc must not exceed 0.01% by weight.
地址 Jena DE