发明名称 Cu BALL
摘要 To provide Cu ball that has less α dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu.;Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, α dose is 0.0200 cph/cm2 or less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%.
申请公布号 US2015313025(A1) 申请公布日期 2015.10.29
申请号 US201214649439 申请日期 2012.12.06
申请人 Senju Metal Industry Co., Ltd. 发明人 KAWASAKI Hiroyoshi;HATTORI Takahiro;ROPPONGI Takahiro;SOMA Daisuke;SATO lsamu
分类号 H05K3/34;B22F1/00;C22C9/00 主分类号 H05K3/34
代理机构 代理人
主权项
地址 Tokyo JP