发明名称 |
Cu BALL |
摘要 |
To provide Cu ball that has less α dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu.;Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, α dose is 0.0200 cph/cm2 or less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%. |
申请公布号 |
US2015313025(A1) |
申请公布日期 |
2015.10.29 |
申请号 |
US201214649439 |
申请日期 |
2012.12.06 |
申请人 |
Senju Metal Industry Co., Ltd. |
发明人 |
KAWASAKI Hiroyoshi;HATTORI Takahiro;ROPPONGI Takahiro;SOMA Daisuke;SATO lsamu |
分类号 |
H05K3/34;B22F1/00;C22C9/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |