发明名称 |
COMPOSITION FOR BONDING AND METAL BONDED BODY USING SAME |
摘要 |
Provided are: a composition for bonding that is capable of obtaining a metal bonded body having a dense bonding layer and high bonding reliability; and a metal bonded body using same. The composition for bonding is in a paste state, includes inorganic particles, an organic component, and a dispersion medium, and is characterized by the average particle diameter of the inorganic particles and the crystallite diameter thereof being 1-20 µm and 4-40 nm, respectively, and by metal particles having a particle diameter of 1-100 nm being attached to at least part of the surface of the inorganic particles. |
申请公布号 |
WO2015162881(A1) |
申请公布日期 |
2015.10.29 |
申请号 |
WO2015JP02097 |
申请日期 |
2015.04.16 |
申请人 |
BANDO CHEMICAL INDUSTRIES, LTD. |
发明人 |
WATANABE, TOMOFUMI;SHIMOYAMA, KENJI;TAKESUE, MASAFUMI;KUBOTA, SHIGEKI |
分类号 |
B22F1/02;B22F7/08;B82Y30/00;B82Y40/00;H01B1/00;H01B1/22 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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