发明名称 COMPOSITION FOR BONDING AND METAL BONDED BODY USING SAME
摘要 Provided are: a composition for bonding that is capable of obtaining a metal bonded body having a dense bonding layer and high bonding reliability; and a metal bonded body using same. The composition for bonding is in a paste state, includes inorganic particles, an organic component, and a dispersion medium, and is characterized by the average particle diameter of the inorganic particles and the crystallite diameter thereof being 1-20 µm and 4-40 nm, respectively, and by metal particles having a particle diameter of 1-100 nm being attached to at least part of the surface of the inorganic particles.
申请公布号 WO2015162881(A1) 申请公布日期 2015.10.29
申请号 WO2015JP02097 申请日期 2015.04.16
申请人 BANDO CHEMICAL INDUSTRIES, LTD. 发明人 WATANABE, TOMOFUMI;SHIMOYAMA, KENJI;TAKESUE, MASAFUMI;KUBOTA, SHIGEKI
分类号 B22F1/02;B22F7/08;B82Y30/00;B82Y40/00;H01B1/00;H01B1/22 主分类号 B22F1/02
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