发明名称 HIGH RELIABILITY INTERCONNECT FOR CONDUCTIVE INK CIRCUITS
摘要 The system and method of electrically interconnecting conductive ink circuits with other electrical components such as wire harnesses, circuit boards, and flexible printed circuits. The rolling contact system does not damage or degrade the conductive ink surface, which snakes it suitable for a high number of insertion/extraction cycles. The system and method features a spring-loaded contact system that is specifically designed for a high number of mating cycles that incorporates one or more rolling conductive elements used to electrically contact a multi-conductor circuit.
申请公布号 WO2015116299(A3) 申请公布日期 2015.10.29
申请号 WO2014US65466 申请日期 2014.11.13
申请人 MIRACO, INC. 发明人 BULMER, DOUGLAS;ROBERTS, JONATHAN
分类号 H01R12/71 主分类号 H01R12/71
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